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Grain boundary diffusion of Ni in ultra-fine grain copper-lead alloy produced by equal channel angular pressing

Ribbe J, Schmitz G, Estrin Y, Divinski S

Research article (journal) | Peer reviewed

Details about the publication

Journal: Defect and Diffusion Forum
Volume: 289-292
Page range: 95-100
Status: Published
Release year: 2009 (31/12/2009)
Language in which the publication is written: English
DOI: 10.4028/www.scientific.net/DDF.289-292.95
Link to the full text: http://www.scopus.com/inward/record.url?partnerID=yv4JPVwI&eid=2-s2.0-70349801087&md5=eb74eed8ac4b655dc4954cfcc8c10df3

Authors from the University of Münster

Divinskyi, Sergii
Professorship of Materials Physics (Prof. Wilde)
Ribbe, Jens
Institute of Materials Physics
Schmitz, Guido
Institute of Materials Physics