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Grain boundary diffusion of Ni in ultra-fine grain copper-lead alloy produced by equal channel angular pressing

Ribbe J, Schmitz G, Estrin Y, Divinski S

Research article (journal) | Peer reviewed

Details about the publication

Journal: Defect and Diffusion Forum
Volume: 289-292
Page range: 95-100
Status: Published
Release year: 2009 (31/12/2009)
Language in which the publication is written: English
DOI: 10.4028/www.scientific.net/DDF.289-292.95
Link to the full text: http://www.scopus.com/inward/record.url?partnerID=yv4JPVwI&eid=2-s2.0-70349801087&md5=eb74eed8ac4b655dc4954cfcc8c10df3

Authors from the University of Münster

Divinskyi, Sergii
Professorship of Materials Physics (Prof. Wilde)
Ribbe, Jens
Institute of Materials Physics
Schmitz, Guido
Institute of Materials Physics

Projects the publication originates from

Diffusion phenomena in nano-crystalline Cu produced by severe plastic deformation (nanocrystalline copper ECAP)
Duration: 12/05/2006 - 08/11/2010
Funded by: DFG - Individual Grants Programme
Type of project: Individual project