Ultrafast diffusion and internal porosity in ultrafine-grained copper-lead alloy prepared by equal channel angular pressing

Ribbe J, Baither D, Schmitz G, Divinski SV

Research article (journal) | Peer reviewed

Abstract

Room-temperature diffusion of Ni-63 radiotracer in ultrafine-grained Cu-1 wt.%Pb alloy prepared by equal channel angular pressing reveals the existence of ultrafast transport paths. Some of these paths remain in the material even after complete recrystallization. Using the focused ion beam technique, numerous cracks/pores are revealed. Long-range tracer penetration over tens of micrometers proves that this internal porosity is interconnected by highly diffusive paths. This network of porosity comprises non-equilibrium interfaces, micropores and microcracks. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Details about the publication

JournalScripta Materialia
Volume61
Issue2
Page range129-132
StatusPublished
Release year2009 (31/07/2009)
Language in which the publication is writtenEnglish
DOI10.1016/j.scriptamat.2009.03.029
KeywordsECAP Ultrafine grained microstructure SEM Copper alloys Grain boundary diffusion boundary self-diffusion different purity cu segregation metals ni

Authors from the University of Münster

Baither, Dietmar
Professur für Materialphysik I (Prof. Schmitz)
Divinskyi, Sergii
Professorship of Materials Physics (Prof. Wilde)
Ribbe, Jens
Institute of Materials Physics
Schmitz, Guido
Institute of Materials Physics