Ion-beam induced atomic mixing in isotopically controlled silicon multilayers

Radek M., Bracht H., Liedke B., Böttger R., Posselt M.

Abstract

Implantation of germanium (Ge), gallium (Ga), and arsenic (As) into crystalline and preamorphized isotopically controlled silicon (Si) multilayer structures at temperatures between 153 K and 973 K was performed to study the mechanisms mediating ion-beam induced atomic mixing. Secondary-ion-mass-spectrometry was applied to determine concentration-depth profiles of the stable isotopes before and after ion implantation. The intermixing is analytically described by a depth-dependent displacement function. The maximum displacement is found to depend not only on temperature and microstructure but also on the doping type of the implanted ion. Molecular dynamics calculations evaluate the contribution of cascade mixing, i.e., thermal-spike mixing, to the overall observed atomic mixing. Calculated and experimental results on the temperature dependence of ion-beam mixing in the amorphous and crystalline structures provide strong evidence for ion-beam induced enhanced crystallization and enhanced self-diffusion, respectively. On the other hand, the former process is confirmed by channeling Rutherford backscattering analyses of the amorphous layer thickness remaining after implantation, the latter process is consistently attributed to the formation of highly mobile Si di-interstitials formed under irradiation and in the course of damage annealing. The observed ion-beam mixing in Si is compared to recent results on ion-beam mixing of Ge isotope multilayers that, in contrast to Si, are fully described by thermal-spike mixing only.