Intermediate temperature embrittlement in high-purity Ni and binary Ni(Bi) alloy
Zheng L., Chellali R., Schlesiger R., Baither D., Schmitz G.
Research article (journal) | Peer reviewedAbstract
The tensile ductility of high-purity Ni and binary Ni(Bi) alloy were studied in the temperature range of 400–850 oC. Ni(Bi) alloyshows evident intermediate temperature embrittlement with a minimum ductility between 700 and 750 oC, while high-purity Ni doesnot. It is concluded that this embrittlement must be an impurity effect. On the basis of quantitative estimates, the embrittlement isinterpreted as being caused by thermo-induced non-equilibrium grain-boundary segregation of Bi.
Details about the publication
Journal: Scripta Materialia
Volume: 65
Page range: 428null
Status: Published
Release year: 2011
Language in which the publication is written: English
Keywords: Ni alloys; Grain-boundary segregation; Tensile test; Embrittlement; Bismuth
Authors from the University of Münster
| Baither, Dietmar | Professur für Materialphysik I (Prof. Schmitz) |
| Schlesiger, Ralf | Institute of Materials Physics |
| Schmitz, Guido | Institute of Materials Physics |