Contact angle and reactive wetting in the SnPb/Cu system
Wedi A, Baither D, Schmitz G
Forschungsartikel (Zeitschrift) | Peer reviewedZusammenfassung
Wetting with a low contact angle is a prerequisite for reliable solder connections. However, the contact angle is only an indirectmeasure of adhesion energy. To quantify this energy, we measured wetting angles of solder droplets as well as surface tension ofSnPb solders under systematic variation of composition. From the data, the effective interface energy is evaluated. Although surfacetension and wetting angle depend continuously on solder composition, the adhesion tension reveals distinguished plateaus which arerelated to different reaction products.
Details zur Publikation
Fachzeitschrift: Scripta Materialia
Jahrgang / Bandnr. / Volume: 64
Ausgabe / Heftnr. / Issue: 7
Seitenbereich: 689-692
Status: Veröffentlicht
Veröffentlichungsjahr: 2011 (31.12.2011)
Sprache, in der die Publikation verfasst ist: Englisch
Link zum Volltext: http://www.scopus.com/inward/record.url?partnerID=yv4JPVwI&eid=2-s2.0-79251598198&md5=86b6c6e2e43bd43a944031da0e9df425
Stichwörter: Reactive wetting; Surface energy; Soldering; Intermetallic compounds
Autor*innen der Universität Münster
| Baither, Dietmar | Professur für Materialphysik I (Prof. Schmitz) |
| Schmitz, Guido | Institut für Materialphysik |
| Wedi, André | Institut für Materialphysik |